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Our company independently developed polyimide adhesive produced by melting at high temperature, which has the characteristics of polyimide resistance to high temperature, high insulation, radiation resistance, self-extinguishing, etc., which is derived and developed on the surface of polyimide film graft treatment, forming one or two sides of the adhesive characteristics at high temperature. The polyimide adhesive tape can be used for thermal bonding between polyimide films and polyimide films, thermal bonding between polyimide films and metal foils, and other composite applications where bonding is required.
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