Description：CNT Thermocompression bonding polyimide film is made up by CEN® CN coating CBDF, under certain temperature and pressure, one side will produce viscosity due coating CBDF. Not only has the characteristics of polyimide film, but also has more excellent performances in bonding strength.
Features:
Single adhesive, environment-friendly with halogen free, highest UL-94 flammability rating:V-0.
Structure：
Property parameter table：
性能Property | 单位Unit | CNT25 | CNT50 | CNT75 | CNT100 | 测试方法 Test Method |
PI 厚度Thickness | μm | 25 | 50 | 75 | 100 | ASTM D374 |
CBDF 厚度Thickness | μm | 5±1 | 5±1 | 5±1 | 5±1 | ASTM D374 |
总厚度Total Thickness | μm | 30±3 | 55±3 | 80±5 | 105±6 | ASTM D374 |
宽度Width | mm | 500 | ASTM D374 |
拉伸强度 Tensile Strength | 纵MD | Mpa | ≥150 | ≥135 | ≥135 | ≥135 | ASTM D882 |
横TD | Mpa | ≥135 | ≥115 | ≥115 | ≥115 | ASTM D882 |
断裂伸长率 Elongation | 纵MD | % | ≥45 | ≥35 | ≥35 | ≥40 | ASTM D882 |
横TD | % | ≥55 | ≥45 | ≥45 | ≥50 | ASTM D882 |
绝缘强度 Dielectric Strength | KV | ≥4.0 | ≥4.50 | ≥9.0 | ≥9.0 | ASTM D149 |
表面电阻 Surface Resistivity | Ω | ≥1.0×1014 | ASTM D257 |
体积电阻 Volume Resistivity | Ω·cm | ≥1.0×1014 | ASTM D257 |
CBDF 玻璃化温度 Glass Transition Temperature | ℃ | 217 | ASTM D3418 |
压合条件 Pressing Conditions | 单面有粘性320-330℃/5min，压力 12kgf/cm² Single adhesive 320-330℃/5min, pressure 12kgf/cm² |
The above data are for reference only.
Application:
Using in bonding situations, heat bonding of PI film to metal foil, thermal bonding of PI film and PI film.
