CNAC Double-Side Thermocompression Bonding Polyimide Film Supplier

Model: CNAC
CNAC Double-Side Thermocompression bonding polyimide film is made up by CEN® CN coating polyimide adhesion, under certain temperature and pressure, both side will produce viscosity due coating polyimide adhesion. Not only has the characteristics of polyimide film, but also has more excellent performances in bonding strength.


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Specification

CNA Double-Side Thermocompression bonding polyimide film is made up by CEN® CN coating polyimide adhesion, under certain temperature and pressure, both sides will produce viscosity due coating polyimide adhesion. The double-side adhesive polyimide film not only has the characteristics of polyimide film, but it also has more excellent performances in bonding strength.

Features:

CNAC Polyimide Film is double-side adhesive, high insulation, environment-friendly with halogen free, highest UL-94 flammability rating:V-0

Structure:

Parameters 

Property

Unit

CNAC25

Test Method

PI Thickness

μm

25

ASTM D374

Binder1 Thickness

μm

5±1

ASTM D374

Total Thickness

μm

33

ASTM D374

Width

mm

500

ASTM D374

Tensile Strength

MD

Mpa

≥130

ASTM D882

TD

Mpa

≥120

ASTM D882

Elongation

MD

%

55

ASTM D882

TD

%

45

ASTM D882

Dielectric Strength

KV

≥4.0

ASTM D149

Surface Resistivity

Ω

≥1.0×1014

ASTM D257

Volume Resistivity

Ω·cm

≥1.0×1014

ASTM D257

Binder1

Glass Transition Temperature

300

ASTM D3418

Pressing Conditions

Double-side adhesive/5min, pressure 20kgf/cm²

Pictures 

Double-Side Thermocompression Bonding Polyimide Film
Double-Side Thermocompression Bonding Polyimide Film
Double-Side Thermocompression Bonding Polyimide Film
Double-Side Thermocompression Bonding Polyimide Film
Double-Side Thermocompression Bonding Polyimide Film
Double-Side Thermocompression Bonding Polyimide Film
Double-Side Thermocompression Bonding Polyimide Film
Double-Side Thermocompression Bonding Polyimide Film

Application

Using in bonding situations, heat bonding of PI film to metal foil, thermal bonding of PI film and PI film.





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