CEN Electronic Material Co., Ltd.

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    CEN®CM polyimide film formed by sputtering metal aluminum, then develops thin aluminum layer, with one side insulation, the other side high conduct electricity. It not only has the performance of excellent heat resistant, mechanical, chemical stability, radiation resistant, and self-extinguishing, but also EMI shielding,high thermal conductivity. Now we have CN polyimide film sputtering aluminum and Black polyimide film sputtering aluminum.

    1. Detailed information
     Product Description

    CEN®CM polyimide film 
    CEN®CM polyimide film formed by sputtering metal aluminum, then develops thin aluminum layer, with one side insulation, the other side high conduct electricity. It not only has the performance of excellent heat resistant, mechanical, chemical stability, radiation resistant, and self-extinguishing, but also EMI shielding,high thermal conductivity. Now we have CN polyimide film sputtering aluminum and Black polyimide film sputtering aluminum.

    Characters:
    EMI shielding
    High-temperature resistance, good radiation resistance
    Halogen-free, environment-friendly, flame-retardant
     

    Application: 
    radiation resistant of the inner space suit,
    EMI shielding, 
    seal material, 
    electromagnetic shielding tape, 
    flexible etching wire.

    Thickness available:25um 50um
    (others are also available to be customized if needed)

    Property:

    NO.

    Testing Item

    Standard value

    1

    Film thickness

    25±3μm

    2

    Aluminum thickness

    0.1μm

    3

    Tensile strength

     

    MD

    ≥150 Mpa

    TD

    ≥145 Mpa

    4

    Elongation

    MD

    ≥45%

    TD

    ≥45%

    5

    Surface Resistivity

    The side of PI film

    ≥1×1012

    The side of aluminum

    ≤1×103

     

     

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